APPLICATION OF Trichoderma spp. TO INCREASE THE QUALITY OF COMPOS AS GROWTH MEDIUM COMPONENT OF PINE SEEDLING (Pinus merkusii Jungh. et de Vriese)
dc.contributor.author | Mardhiansyah, Muhammad | |
dc.date.accessioned | 2014-05-22T04:20:51Z | |
dc.date.available | 2014-05-22T04:20:51Z | |
dc.date.issued | 2014-05-22 | |
dc.description.abstract | The experiment aimed to evaluate the effect of application of Trichoderma spp. during composition processing of the quality of resulted compos as the growth medium component of pine seeds. Compos made from organic debris as the main component and fresh cow dung decomposer. Pellets of three species of Trichoderma i.e T.Koningii (T1), T.reesei (T13) dan T.harzianum (T27) were substituted 0.1% from weight of compos into the compos at day 10, 20, 30 during the decomposition of organic debris by containerizing the treated composes in nylon gauze container and inoculated in the compos mass. At day 70 the compos were harvest and used as the growth medium component of pine seeds. Results showed that application of T1 at day 20 lowered the C-N ratio at amount of 16.8%. Application T27 showed the best top-root ratio of seedling (4,49). | en_US |
dc.description.sponsorship | Seminar UR-UKM ke-7 2012 | en_US |
dc.identifier.isbn | 978-602-18936-0-9 | |
dc.identifier.other | wahyu sari yeni | |
dc.identifier.uri | http://repository.unri.ac.id/xmlui/handle/123456789/6317 | |
dc.language.iso | en | en_US |
dc.subject | Trichoderma spp | en_US |
dc.subject | compos | en_US |
dc.subject | pine seddling | en_US |
dc.title | APPLICATION OF Trichoderma spp. TO INCREASE THE QUALITY OF COMPOS AS GROWTH MEDIUM COMPONENT OF PINE SEEDLING (Pinus merkusii Jungh. et de Vriese) | en_US |
dc.type | UR-Proceedings | en_US |
Files
Original bundle
1 - 1 of 1
No Thumbnail Available
- Name:
- 63 makalah oral.pdf
- Size:
- 328.23 KB
- Format:
- Adobe Portable Document Format
- Description:
- artikel
License bundle
1 - 1 of 1
No Thumbnail Available
- Name:
- license.txt
- Size:
- 1.71 KB
- Format:
- Item-specific license agreed upon to submission
- Description: